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Shanghai South Ocean Electron Co.,LTD.    

Company Production Certificate Technology Feed Back

1.Technical glossary

2.Test procedures

3.Marking standards

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2.Test procedures

2.1 Typical Qualification Tests for Quartz Crystals

TEST TYPE TEST METHOD TEST CONDITION
Electrical Characteristics Internal Specification Per Specification
Frequency vs. Temperature Internal Specification Per Specification
Mechanical Shock MIL-STD-202, Method 213, C 100 g's
Vibration MIL-STD-202, Method 204 10 g's from 10 - 2000 Hz
Thermal Cycle MIL-STD-202, Method 107, B -55°C to +125°C, 15 Min Dwell, 10 Cycles
Aging Internal Specification 168 Hours at 105°C
Gross Leak MIL-STD-202, Method 112, D 30 Second Immersion, No Bubble Stream
Fine Leak MIL-STD-202, Method 112, C Must Meet 1x10-8 atm-cm3/sec Max.
Solderability MIL-STD-202, Method 208 8 Hour Steam Age, Must Exhibit 95% Coverage
Resistance to Solvents MIL-STD-202, Method 215, C Three 1 Minute Soaks
Terminal Pull MIL-STD-202, Method 211, A Wires - 2 Pounds, Pins - 4 Pounds
Terminal Bend MIL-STD-202, Method 211, B 2 bending Cycles
Wire-Lead Bend MIL-STD-202, Method 211, C 1 Pound, 3 Bends per Lead
Physical Dimension Internal Specification Per Specification
Internal Visual Internal Specification Per Internal Specification

 

2.1 Typical Qualification Tests for Crystal Oscillators

TEST TYPE TEST METHOD TEST CONDITION
Electrical Characteristics Internal Specification Per Specification
Frequency vs. Temperature Internal Specification Per Specification
Mechanical Shock MIL-STD-202, Method 213 100 g's
Vibration MIL-STD-883, Method 2007, A 20 g's Peak to Peak from 10 - 2000 Hz sweep
Thermal Cycle MIL-STD-883, Method 1011, B -55°C to +125°C, 15 Min Dwell, 10 Cycles
Aging Internal Specification 168 Hours at 105°C
Gross Leak MIL-STD-202, Method 112, D 30 Second Immersion, No Bubble Stream
Fine Leak MIL-STD-202, Method 112, C Must Meet 2x10-8 atm-cm3/sec Max.
Solderability MIL-STD-883, Method 2003 8 Hour Steam Age, Must Exhibit 95% Coverage
Resistance to Solvents MIL-STD-883, Method 2015 Three 1 Minute Soaks
Terminal Pull MIL-STD-883, Method 2004, A 2 Pounds
Lead Bend MIL-STD-883, Method 2004, B1 1 bending Cycles
Physical Dimension Internal Specification Per Specification
Internal Visual Internal Specification Per Internal Specification
Soldering Conditions Pin Thru Packages

Surface Mount Devices

260ºC, for 10s, Max.

260ºC, for 10s, Max. or 230ºC, for 90s, Max.

 

2.3 Oscillators Electrical Test Circuits

      TTL Test Circuit

       

 

        HCMOS Test Circuit

       

 

        ECL Test Circuit

       

 

        PECL Test Circuit

       

 

1.Technical glossary

2.Test procedures

3.Marking standards

Back to top

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